Home > Ultra Soft Thermal Pad >

Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/m.K

Product Categories

Thermal Conductive Pad [58]
Ultra Soft Thermal Pad [56]
Silicone Free Thermal Pad [34]
Heat Sink Thermal Grease [40]
Thermally Conductive Encapsulant [37]
Thermal Conductive Gap Filler [31]
Liquid Gap Filler [26]
Electrical Insulation Sheet [30]
Thermal Pad Material [40]
Thermal Insulation Pad [40]

Shenzhen Aochuan Technology Co., Ltd

Contact Now

Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/m.K

Brand Name : AOK

Model Number : UTP100

Certification : RoHS, Reach, UL

Place of Origin : China

MOQ : 1000pcs

Payment Terms : T/T

Delivery Time : 13-15working days

Packaging Details : 400mmx200mm

Tensile Strength(KN/m) : 2.5

Elongation(%) : 60

Usage Temperature(℃) : -40~150

Product name : Ultra Soft Thermal Pad High Mechanical Strength with 1.0w thermal conductivity

Density : 2.5(g/cc)

Hardness : 30±5(Shore OO)

Contact Now

Ultra Soft Thermal Pad High Mechanical Strength with 1.0W/m.K thermal conductivity

Attribute	Value	Test Method
Composition	Ceramic Filler, Silicone, and Reinforced Fiberglass	-
Color	White and Brick Red	Visual
Thickness(mm)	0.5~12.0	ASTM D374
Density(g/cc)	2.5	ASTM D792
Hardness(shore oo)	30±5	ASTM D2240
Tensile Strength(KN/m)	2.5	ASTM D624
Elongation(%)	60	ASTM D412
Usage Temperature(℃)	-40~150	--
Electrical
Breakdown Voltage(kv/mm)	≥7.0	ASTM D149
Dielectric Constant(@10mhz)	5.7	ASTM D150
Volume Resistivity(Ω.cm)	1.0*10¹³	ASTM D257
Flammability	V-0	UL94
Thermal
Thermal conductivity(W/m.K)	1.0±0.1	ASTM D5470

Product feature:
■ Naturally tacky on one side
■ High breakdown voltage
■ High Tear Strength 2.5 kN /m
■ Elongation 60%

■ because the air is a bad conductor of heat, it will seriously hinder the transfer of heat between the contact surface, and the thermal silicone sheet can be installed between the heat source and the radiator to squeeze the air out of the contact surface;

■ with the addition of thermal silica gel, can make the contact surface between the heat source and the radiator better full contact, really do face to face contact. The reaction at temperature can achieve as small a temperature difference as possible;

Typical applications:
■ IT: Notebooks, Tablets, Power Conversion
■ IT: Automotive: Control Modules, Turbo Actuators
■ Consumer Electronics: Gaming Systems, and LCDs

Purchase information:

Standard size: 200*400mm, which can be die-cut into various sizes and shapes as specified by customers. The increasing gradient of thickness is 0.25mm

Multiscene Cooling Laptop CPU Thermal Pad Anti Interfere 1W/m.K

Product Tags: